We provide an optimized package solution that matches functions of IC to ensure long-term use in various usage environments and electrical signal transmission between IC chips and electronic product boards.

We support the selection of good products according to market requirements through the Chip Probe test at the Wafer Die Level and the Final test at the IC Package Level. We provide a stability solution that can prevent mass production risk in advance by managing the yield improvement in mass production.

Quality is a rudimentary factor to meet for successful market entry. Therefore, we support various quality specifications, from design to a final test, to help develop high-quality semiconductor products.

We apply semiconductor test conditions that meet customer product's mass production verification to diagnose product lifespan and stability and support performance improvement through IC package level test under accelerated stress conditions.